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US 2004/0017501 A1Published application
Electronic device
OwnerJun Asaga, Hiroshi Mukaigawa +3inventors
InventorsJun Asaga, Hiroshi Mukaigawa, Kazuaki Hashimoto, Tomoyuki Sasaki, Akio Shimane
Life of this patent
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Abstract
An electronic device comprises a substrate mounting an electronic component, a shielding case molded with conductive resin and connected to the substrate, and a conductive coating formed on the surface of the shielding case. Since the shielding case is molded from the conductive resin, it is possible to mold the case into any shapes and provide smaller and lighter cases than the metal ones.
Claims13
An electronic device comprising:
- a substrate mounting an electronic component;
- a shielding case formed from conductive resin and connected to the substrate;
- and
- a conductive coating formed on a surface of the shielding case.
1 more element
An electronic device comprising:
- a substrate mounting an electronic component;
- a case connected to the substrate for sealing the electronic component;
- a venthole formed in the substrate;
- and
- a sealing member filled in the venthole.
2 more elements
A communication apparatus comprising:
- a substrate mounting an image pickup element;
- and
- a lens holder which is formed from conductive resin, has a conductive coating formed on the surface, and is connected to the substrate.
Dependencies are inferred from the claim text.