Electroluminescent display device and its manufacturing method

A manufacturing method of an electroluminescenct display device, comprising:

• disposing a thin film transistor on a substrate;
• disposing a planarization insulating film made of a photosensitive material over the thin film transistor;
• performing a half exposure processing and a development processing on the planarization insulating film to form a concave and convex structure on a surface of the planarization insulating film;
• disposing a photoresist layer with an opening portion on the surface of the planarization insulating film with the concave and convex structure;
• performing a full exposure processing and a development processing on the planarization insulating film using the photoresist layer as a mask to form a contact hole in the planarization insulating film;
• disposing an anode connected to a source or a drain of the thin film transistor through the contact hole;
• disposing an emissive layer over the anode;
• and
• disposing a cathode over the emissive layer.

A manufacturing method of an electroluminescenct display device, comprising:

• disposing a thin film transistor on a substrate;
• disposing an insulating film over the thin film transistor;
• forming a concave and convex structure on a surface of the insulating film;
• forming a contact hole in the insulating film with the concave and convex structure;
• disposing an anode connected to a source or a drain of the thin film transistor through the contact hole;
• disposing an emissive layer over the anode;
• and
• disposing a cathode over the emissive layer.

A manufacturing method of an electroluminescenct display device, comprising:

• disposing a thin film transistor on a substrate;
• disposing an interlayer insulating film over the thin film transistor;
• forming a plurality of convex portions made of an insulating film on the interlayer insulating film;
• disposing a planarization insulating film over the interlayer insulating film with the convex portions;
• forming a contact hole in the planarization insulating film;
• disposing an anode connected to a source or a drain of the thin film transistor through the contact hole;
• disposing an emissive layer over the anode;
• and
• disposing a cathode over the emissive layer.