Integrated circuit device with exposed upper and lower die surfaces

An electrical assembly comprising:

• a printed circuit board having a plurality of integrated circuit (IC) devices disposed on a first surface of said printed circuit board, at least one of said IC devices comprising:
• an integrated circuit (IC) die having a first surface, a second surface opposite said first surface, and sidewalls extending between said first surface and said second surface;
• and
• an integrated circuit (IC) package for supporting said IC die, wherein said IC package is attached to at least one of said sidewalls of said IC die such that at least a portion of said IC die first surface and at least a portion of said IC die second surface are exposed.

An integrated circuit (IC) device comprising:

• an integrated circuit (IC) die having a first surface, a second surface opposite said first surface, and sidewalls extending between said first surface and said second surface;
• and
• an intermediate substrate having a first surface, a second surface opposite said first surface, and sidewalls extending between said first surface and said second surface, wherein said intermediate substrate second surface lies in substantially the same plane as said IC die second surface;
• and
• an integrated circuit (IC) package for supporting said IC 11 die and said intermediate substrate, wherein said IC package is attached to at least one IC die sidewall and at least one intermediate substrate sidewall, such that at least a portion of said IC die first surface and at least a portion of said IC die second surface are exposed and at least a portion of said intermediate substrate second surface is exposed.