Test tray with carrier modules for a semiconductor device handler
AssigneeMirae Corporation
InventorsChul Ho Ham, Chan Ho Park, Woo Young Lim, Jae Bong Seo
Life of this patent
Estimating the term…
Abstract
A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.
Claims22
A carrier module for a semiconductor device handler, the carrier module configured to be fitted to a test tray in a semiconductor device handler and configured to detachably hold a semiconductor device, the carrier module comprising:
- a carrier body configured to be positioned on a test tray;
- a device seating part on a top surface of the carrier body configured to receive a semiconductor device;
- at least one holding member configured to detachably hold the semiconductor device on the device seating part;
- a pass through hole formed in the device seating part configured to pass cooling fluid pass therethrough;
- and
- a plurality of guide grooves formed in a surface of the device seating part in fluid communication with the pass through hole and configured to guide cooling fluid, sprayed onto a lower side of the carrier body and passed through the pass through hole, across portions of the surface of the semiconductor device extending to the periphery of the semiconductor device.
A test tray configured to carry a plurality of semiconductor devices in a test handler, comprising:
- a test tray body;
- and
- a plurality of carrier modules removably mounted on the test tray body, wherein each carrier module comprises:
- a carrier body configured to be positioned on a test tray,
- a device seating part on a top surface of the carrier body configured to receive a semiconductor device,
- at least one holding member configured to detachably hold the semiconductor device on the device seating part,
- a pass through hole formed in the device seating part configured to pass cooling fluid pass therethrough, and
- a plurality of guide grooves formed in a surface of the device seating part in fluid communication with the pass through hole and configured to guide cooling fluid, sprayed onto a lower side of the carrier body and passed through the pass through hole, across portions of the surface of the semiconductor device extending to the periphery of the semiconductor device.
Dependencies are inferred from the claim text.