MEMS device integrated chip package, and method of making same

A process of forming a micro electromechanical (MEMS) package comprising:

• providing a semiconductor device;
• providing a conveyance with at least one embedded MEMS device disposed therein;
• and
• disposing the conveyance over the semiconductor device, wherein the at least one embedded MEMS device communicates electrically to the semiconductor device.

A process comprising:

• providing a semiconductor device;
• accommodating a detached micro electromechanical structure (MEMS) device upon the semiconductor device;
• providing a conveyance over the semiconductor device and around the detached MEMS device;
• and
• contacting encapsulation material with at least one of the semiconductor device, the detached MEMS device, and the conveyance to form an integrated MEMS package.

A micro electromechanical structure (MEMS) package comprising:

• a semiconductor device;
• a sealing structure disposed over the semiconductor device;
• at least one detached MEMS in a first structure disposed over the sealing structure, wherein the at least one detached MEMS is selected from a capacitor, a switch, an oscillator, an inductor, a power supply, and combinations thereof;
• at least one embedded MEMS in a conveyance, wherein the at least one embedded MEMS is selected from a capacitor, a switch, an oscillator, an inductor, a power supply, and combinations thereof;
• and
• encapsulation material disposed over at least one of the conveyance and at least one of the at least one detached MEMS, and the semiconductor device.