Semiconductor device
OwnerHideki Okumura, Hitoshi Kobayashi +5inventors
InventorsHideki Okumura, Hitoshi Kobayashi, Masanobu Tsuchitani, Akihiko Osawa, Satoshi Aida, Shigeo Kouzuki, Masaru Izumisawa
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Abstract
There is provided a semiconductor device including a semiconductor substrate with a trench, and a particulate insulating layer filling at least a lower portion of the trench and containing insulating particles. The semiconductor device may further include a reflowable dielectric layer covering an upper surface of the particulate insulating layer, the insulating particles being stable at the melting point or the softening point of the reflowable dielectric layer.
Claims25
A semiconductor device, comprising:
- a semiconductor substrate with a trench;
- a particulate insulating layer filling at least a lower portion of the trench and comprising insulating particles;
- and
- a reflowable dielectric layer covering an upper surface of the particulate insulating layer, the insulating particles being stable at a melting point or a softening point of the reflowable dielectric layer.
A semiconductor device, comprising:
- a semiconductor substrate with a trench;
- and
- a particulate insulating layer filling at least a lower portion of the trench and comprising first and second insulating particles, an average diameter of the second insulating particles being smaller than an average diameter of the first insulating particles.
A semiconductor device, comprising:
- a semiconductor substrate with a trench;
- and
- a particulate insulating layer filling at least a lower portion of the trench and comprising insulating particles and an insulating binder that bonds the insulating particles together, the insulating particles and the insulating binder forming a network structure.
A semiconductor device, comprising:
- a semiconductor substrate with a trench;
- and
- a particulate insulating layer filling at least a lower portion of the trench and including first and second particulate insulating layers, the first particulate insulating layer comprising first insulating particles with no binder, and the second particulate insulating layer covering an upper surface of the first particulate insulating layer and comprising second insulating particles and an insulating binder.
Dependencies are inferred from the claim text.