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US 2004/0016951 A1Published application
Semiconductor device and manufacturing method thereof
OwnerIchiro Mizushimainventor
Life of this patent
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Abstract
A semiconductor device of this invention comprises a semiconductor substrate, a plurality of memory regions provided on the semiconductor substrate, the plurality of memory regions having the same structure, and functional region provided on the semiconductor substrate, the functional region including a different function from the memory.
Claims29
A semiconductor device comprising:
- a semiconductor substrate;
- a plurality of memory regions provided on the semiconductor substrate, the plurality of memory regions having the same structure;
- and
- a functional region provided on the semiconductor substrate, the functional region including a different function from the memory.
1 more element
A method of manufacturing a semiconductor device comprising:
- preparing a wafer on which predetermined steps of forming memories have been performed, the wafer including a plurality of memory regions having the same structure,
- performing steps subsequent to the predetermined steps of forming the memories on one region of the wafer, the one region including at least one of the plurality of memory regions and forming a functional region having a different function from a memory function on the one region;
- and
- cutting out the one region from the wafer.
1 more element
A method of manufacturing a semiconductor device comprising:
- preparing a plurality of wafers on which predetermined steps of forming memories have been performed, the plurality of wafers including a plurality of memory regions respectively, structures of the plurality of memory regions of the plurality of wafers being equal each other and memory capacities of the plurality of memory regions of the plurality of wafers being different each other;
- selecting one wafer from the plurality of wafers;
- performing steps subsequent to the predetermined steps of forming the memories on one region of the selected wafer, the one region including at least one of the plurality of memory regions and forming a region having a different function from a memory function on the one region;
- and
- cutting out the one region from the selected wafer.
2 more elements
Dependencies are inferred from the claim text.