Semiconductor device inspecting apparatus
AssigneeSuruga Seiki Co., Ltd.
InventorKoshi Haraguchi
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Abstract
The present invention provides a semiconductor device inspecting apparatus capable of generating a sharp cut cross section. The semiconductor device inspecting apparatus 1 comprises a stage 141 disposed in a vacuum chamber 11 in which a semiconductor device (sample S) is set, a femtosecond laser apparatus 12 for generating femtosecond laser beams FSLB which cut the semiconductor device, and an electron microscope (SEM 17) which observes a cut surface W of the semiconductor device which was cut by the laser beams.
Claims3
A semiconductor device inspecting apparatus comprising a stage disposed in a chamber in which a semiconductor device is set, a femtosecond laser apparatus for generating laser beams which cut said semiconductor device, and an electron microscope for observing a cut surface of said semiconductor device which was cut by said laser beams.
Dependencies are inferred from the claim text.