Back to results
US 2004/0016752 A1Published application
Solder reflow with microwave energy
AssigneeIntel Corporation
InventorsGlenn Ratificar, Carlos Gonzalez, Lejun Wang
Life of this patent
Estimating the term…
Abstract
The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
Claims17
A method comprising:
- forming a solder over a substrate;
- placing said solder in contact with an input/output connection of a die;
- heating said substrate and said die with microwave energy to reflow said solder;
- and
- forming a mechanical joint between said substrate and said die.
2 more elements
A method comprising:
- forming a final passivation layer over a die;
- removing said final passivation layer over a bond pad of said die;
- forming an Under Bump Metallurgy (UBM) over said bond pad and said passivation layer;
- forming a photoresist over said UBM;
- uncovering a first portion of said UBM by selectively removing said photoresist, said first portion disposed over said bond pad;
- covering said first portion of said UBM by selectively forming a first solder;
- removing rest of said photoresist;
- removing a second portion of said UBM, said second portion not covered by said first solder;
- reflowing said first solder into a bump;
- placing said bump in contact with a second solder on a substrate;
- and
- reflowing said second solder with microwave energy.
9 more elements
A mechanical joint comprising:
- a bump on a die;
- and
- a solder on a substrate wherein said solder was reflowed by microwave energy.
Dependencies are inferred from the claim text.