Method of curing an anisotropic conductive compound

A method of forming an electronic assembly comprising the steps of:

• (a) providing a substrate having a first arrangement of conductive contacts;
• (b) providing an electronic component having a second arrangement of conductive contacts;
• (c) depositing an uncured anisotropic conductive material on the first arrangement of conductive contacts;
• (d) positioning the electronic component on the anisotropic conductive material with each conductive contact of the fist arrangement aligned with a corresponding conductive contact of the second arrangement;
• (e) heating the anisotropic conductive material to a curing temperature for a curing interval sufficient to cause the anisotropic conductive material to cure to a solid;
• and
• (f) during step (e), subjecting the anisotropic conductive material to an AC magnetic field followed by a static, substantially homogeneous DC magnetic field, wherein each magnetic field has a field vector direction that is substantially parallel with the alignment of each conductive contact of the first arrangement with the corresponding conductive contact of the second arrangement.