Back to results
US 2004/0006174 A1Published application
Polyamide-imide resin solution and the use thereof for producing wire enamels
AssigneeAltana Electrical Insulation GmbH
InventorsSascha Tödter König, Klaus Wilhelm Lienert, Gerold Schmidt
Life of this patent
Estimating the term…
Abstract
The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170° C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.
Claims18
Polyamideimide resin solution preparable by reacting
- (a) aromatic polycarboxylic acids and/or their anhydrides with
- (b) aromatic imide- and amide-forming components having a functionality of greater than two, preferably from 2.1 to 3,
- in cresol by reaction at temperatures above 170° C.
Dependencies are inferred from the claim text.