Connector
AssigneeFujitsu Component Limited
InventorsShiho Sato, Takeshi Ito, Noboru Shimizu, Hideo Miyazawa
Life of this patent
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Abstract
A new connector that is reduced in size and has a higher density of contacts implemented therein is provided. This connector has a contact module arranged on a connector main body. The contact module is formed into a sheet structure, and a plurality of contacts are arranged therein. Further, the contact module is bent into a C-shaped structure along the extending direction of the contacts, and is implemented to the connector main body in this state. Contact points of the connector are energized by sets of a coil spring and two push pins arranged on both sides of the coil spring so that these contact points protrude from holes formed at the connector main body.
Claims8
A connector that connects principal planes of two substrates, comprising:
- a connector main body;
- and
- a contact module that is arranged on said connector main body;
- wherein
- said contact module comprises:
- a sheet made of metal;
- an insulating film formed on said sheet;
- and
- a contact point and a circuit pattern that are thin films of precious metal formed on said insulating film;
- wherein:
- a plurality of said contact points and said circuit patterns are arranged to form a plurality of contacts, the contact module being bent into a C-shaped structure along an extending direction of said contacts to be implemented on the connector main body, and two protruding portions of said C-shaped structure of said contact module corresponding to said contact points.
A connector implemented in a testing apparatus that performs a continuity test on a semiconductor device, said connector connecting a circuit of said testing apparatus and a terminal of a substrate that is electrically connected to said semiconductor device, and comprising:
- a connector main body;
- and
- a contact module that is arranged on said connector main body;
- wherein:
- said contact module comprises:
- a sheet made of metal;
- an insulating film formed on said sheet;
- and
- a contact point and a circuit pattern that are thin films of precious metal formed on said insulating film;
- wherein:
- a plurality of said contact points and said circuit patterns are arranged to form a plurality of contacts, said contact module being bent into a C-shaped structure along an extending direction of said contacts to be implemented on said connector main body, and two protruding portions of said C-shaped structure of said contact module corresponding to said contact points.
Dependencies are inferred from the claim text.