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US 2004/0005790 A1Published application
Ball grid array jumper
AssigneeIntel Corporation
InventorsJohn T. Sprietsma, Lilly Huang, Henry W. Koertzen
Life of this patent
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Abstract
A circuit board assembly is provided, comprising a first circuit board and a ball-grid array jumper. The ball-grid array jumper comprises a second circuit board smaller in size than the first printed circuit board and has at least one layer of conductive traces and at least two solder ball connectors. The ball grid array jumper is mounted to the first printed circuit board via the solder ball connectors.
Claims24
A circuit board assembly, comprising:
- a first circuit board;
- and
- a ball-grid array jumper, the ball-grid array jumper comprising a second circuit board smaller in area than the first printed circuit board and having at least one layer of conductive traces and at least two solder ball connectors, and the ball grid array jumper mounted to the first printed circuit board via the at least two solder ball connectors.
A ball-grid array jumper, comprising:
- a jumper circuit board smaller in size than a main circuit board and having at least one layer of conductive traces and at least two solder ball connectors, and the ball grid array jumper mounted to the main circuit board via the at least two solder ball connectors.
A method of making a printed circuit board assembly, comprising:
- mounting a ball-grid array jumper to a main circuit board, the ball-grid array jumper comprising a jumper circuit board smaller in size than the main printed circuit board and having at least one layer of conductive traces and at least two solder ball connectors, the ball grid array jumper mounted to the first printed circuit board via the at least two solder ball connectors.
A computerized system, comprising:
- a motherboard;
- a processor;
- and
- at least one ball-grid array jumper, the at least one ball-grid array jumper comprising a circuit board smaller in area than the motherboard and having at least one layer of conductive traces and at least two solder ball connectors, and the at least one ball grid array jumper mounted to the motherboard via the at least two solder ball connectors.
1 more element
Dependencies are inferred from the claim text.