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US 2004/0005772 A1Published application
Method of producing copper foil solder bump
OwnerChang-hee Choi, Sang-yum Kim +1inventors
InventorsChang-hee Choi, Sang-yum Kim, Cha-Je Cho
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Abstract
The present invention discloses a method of producing a copper foil used for a printed circuit board (PCB). In this method of producing a copper foil for a solder bump, metal surfaces are activated by plasma or primer treatment and finally are clad using a pressing means in a process of cladding a copper foil constituting a bump and a copper foil forming a circuit. Therefore, it is possible to produce a copper foil for a PCB with excellent adhesion strength without carrying out any bump forming process.
Claims3
A method of producing a copper foil for a solder bump, comprising the steps of:
- coating a first copper foil with a stop layer;
- charging the first copper foil and a second copper foil coated with no stop layer into a vacuum chamber;
- passing the first and second copper foils charged into the vacuum chamber through a plasma treatment tank;
- and
- cladding the first and second copper foils that have passed through the plasma treatment tank by a pressing means.
2 more elements
Dependencies are inferred from the claim text.