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US 2004/0005770 A1Published application
Semiconductor devices with permanent polymer stencil and method for manufacturing the same
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Alan G. Wood, James M. Wark, David R. Hembree, Syed Sajid Ahmad, Michael E. Hess, John O. Jacobson
Life of this patent
Estimating the term…
Abstract
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
Claims71
A method of connecting a semiconductor device to an electronic circuit, comprising:
- providing at least one semiconductor device having an active surface with at least one contact pad exposed thereover;
- applying at least a first layer of material over the entire surface of the at least one semiconductor device;
- forming at least one aperture in the at least first layer of material so that the at least one aperture extends through the entire at least first layer of material and exposes only the at least one contact pad;
- and
- applying a mixture of solder and flux to the at least one aperture so as to fill the at least one aperture to a level that is even with the top surface of the at least first layer of material.
2 more elements
A method of connecting a semiconductor device to an electronic circuit, comprising:
- providing at least one semiconductor device having an active surface with at least one contact pad exposed thereover;
- selecting at least one portion of the active surface to be covered with at least a first layer of material;
- applying the at least first layer of material over the at least one portion of the active surface of the at least one semiconductor device;
- forming at least one aperture in the at least first layer of material so that the at least one aperture extends through the entire at least first layer of material, exposes only the at least one contact pad, and has a cross-sectional shape that is the same as the cross-sectional shape of the at least one contact pad and cross-sectional dimensions that are at least the same as the cross-sectional dimensions of the at least one contact pad;
- applying a mixture of solder and flux to the at least one aperture so as to fill the at least one aperture to a level that is even with the top surface of the at least first layer of material;
- and
- heating the at least one semiconductor device to a temperature sufficiently high to cause the mixture of solder and flux to reflow and form at least one solder bump.
4 more elements
A method of connecting a semiconductor device to an electronic circuit, comprising:
- providing at least one semiconductor device having an active surface with at least one contact pad exposed thereover;
- selecting at least one portion of the active surface to be covered with at least a first layer of material;
- applying the at least first layer of material over the at least one portion of the active surface of the at least one semiconductor device;
- forming at least one aperture in the at least first layer of material so that the at least one aperture extends through the entire at least first layer of material, exposes only the at least one contact pad, and has a cross-sectional shape that is the same as the cross-sectional shape of the at least one contact pad and cross-sectional dimensions that are at least the same as the cross-sectional dimensions of the at least one contact pad;
- and
- applying a conductive polymer paste to the at least one aperture so as to fill the at least one aperture to a level that is even with the top surface of the at least first layer of material.
3 more elements
A semiconductor device, comprising:
- at least one substrate with at least one contact pad exposed over an active surface thereof,
- at least a first removable layer of material to cover at least one portion of the active surface of the at least one substrate, said at least first removable layer of material having a top surface and a bottom surface and at least one aperture formed therein passing from the top to the bottom surfaces, wherein the at least one aperture exposes only the at least one contact pad and has a cross-sectional shape that is the same as the cross-sectional shape of the at least one contact pad and cross-sectional dimensions that are at least the same as the cross-sectional dimensions of the at least one contact pad;
- and
- a mixture of solder and flux applied to the at least one aperture such as to fill the at least one aperture to a level that is even with the top surface of the at least first removable layer of material so as to form at least one solder bump after the temperature of the semiconductor device is increased sufficiently to cause the mixture of solder and flux to reflow in preparation to attach the semiconductor device to an electronic circuit.
1 more element
Dependencies are inferred from the claim text.