Method for attaching an integrated circuit on a silicon chip to a smart label
AssigneeRafsec Oy
InventorSamuli Stromberg
Life of this patent
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Abstract
A method for manufacturing a smart label web comprises smart labels placed one after and/or next to each other and comprising a circuitry pattern and an intergrated circuit on a chip therein. In the method, an electric contact is formed between the integrated circuit on the chip and the circuitry pattern on the smart label of the smart label web. The integrated circuit on the chip is attached to the circuitry of the smart label by means of a thermoplastic film on the surface of the chip.
Claims12
A method for manufacturing a smart label web comprising smart labels one after another and/or side by side, which smart labels include a circuitry pattern and an integrated circuit on a chip attached to the smart label, the method comprising forming an electric contact between the integrated circuit on the chip and the circuitry pattern on the smart label of the smart label web, wherein the integrated circuit on the chip is attached to the circuitry pattern of the smart label by a thermoplastic film on a surface of the chip.
A method for pretreatment of silicon wafer, comprising:
- providing integrated circuitry with bumps;
- checking the integrated circuits for functionality;
- attaching a thermoplastic film to a surface of a wafer;
- and
- separating the integrated circuits into single chips.
Dependencies are inferred from the claim text.