Method and apparatus using nanotubes for cooling and grounding die

A thermal interface layer for use as a intermediate in manufacturing a circuit package containing a die and a thermal management aid, the layer comprising:

• an array of carbon nanotubes oriented with longitudinal axes of a substantial percentage of the nanotubes having a substantially common orientation to form a direct path from a first to a second surface thereof;
• and
• a matrix of interstitial material substantially encapsulating the nanotubes with the exception of the tips of the nanotubes projecting from at least one of the first and second surfaces thereof to be embedded into at least one of the thermal management aid and the die.

A process for coupling a die to a thermal management aid, comprising:

• forming an array of nanotubes on a surface of the die;
• and
• mounting the thermal management aid adjacent and in contact with the array of nanotubes to couple the die to the thermal management aid.

A process for providing a thermal conduction path from circuit die to a thermal management aid, the process comprising:

• positioning the thermal management aid adjacent the die;
• and
• forming an array of nanotubes between the surface of the die and the thermal management aid with the layer of nanotubes providing a thermal conduction path between the die and the thermal management aid.

The process of 23, wherein forming the array of nanotubes comprises forming a plurality of bundles nanotubes on the surface of the die.