Methods and apparatus for verifying circuit board design

A method for verifying a design of a circuit board having a wiring layer connecting components to be mounted, a power layer, an insulating layer formed between said wiring layer and said power layer, and mounting prearranged parts, on which cable-connection connectors are mounted, comprising the steps of:

• detecting in an opposing region in which said wiring layer and said power layer are opposed to each other, a chipping of said power layer, which corresponds to one wiring layer and interrupts said opposing region;
• computing, in a case that the chipping is detected, a propagation value of a common-mode voltage expected at the connector when the common-mode voltage generated at the chipping propagates and reaches the connector;
• and
• outputting, according to the computed propagation value, information representing whether or not a countermeasure for suppressing radiation of electromagnetic waves is applied to the connector or a cable connected to the connector.

An apparatus for verifying a design of a circuit board having a wiring layer connecting components to be mounted, a power layer, and an insulating layer formed between said wiring layer and said power layer, comprising:

• a detecting portion for detecting in an opposing region in which said wiring layer and said power layer are opposed to each other, a chipping of said power layer, which corresponds to one wiring layer and interrupts said opposing region;
• a computing portion for computing a common-mode voltage to be expected to be caused at the chipping;
• and
• an output portion for outputting a position of the chipping and a value of the common-mode voltage caused owing to the chipping.

An apparatus for verifying a design of a circuit board having a wiring layer connecting components to be mounted, a power layer, an insulating layer formed between said wiring layer and said power layer, and mounting prearranged parts, on which cable-connection connectors are mounted, comprising:

• a detecting portion for detecting in an opposing region in which said wiring layer and said power layer are opposed to each other, a chipping of said power layer, which corresponds to one wiring layer and interrupts said opposing region;
• a computing portion for computing, in a case where the chipping is detected, a propagation value of a common-mode voltage expected at the connector when the common-mode voltage generated at the chipping propagates and reaches the connector;
• and
• an output portion for outputting, according to the computed propagation value, information representing whether or not a countermeasure for suppressing radiation of electromagnetic waves is applied to the connector or a cable connected to the connector.