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AssigneeSiemens Medical Solutions USA, Inc.
InventorsTodor Sheljaskow, Grazyna Palczewska, Stephen C. Englund, Thomas G. Houck, Gregg W. Frey, Ron Ho, Sevig Ayter, Xiaocong Guo
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Transducer arrays and methods of manufacturing the transducer arrays are provided. A multi-dimensional transducer array is provided where the element-to-element spacing or pitch along one dimension is less than the element spacing or pitch along a second dimension. For example, the element pitch along an azimuth dimension is ½ of the element pitch along an elevation dimension. The multi-dimensional transducer array with the same or different pitch is manufactured from a plurality of modules. Each of the modules are separately diced and then aligned and combined. Separate dicing allows for individual testing of modules prior to assembly as a transducer array. Elements of a transducer array are used for isolating a transmit channel from a receive channel. Rather than a sheet of electrode acting as a ground plane common to a plurality of elements, separate signal lines or traces are provided individually for each element on opposite sides of each element. A transmit channel may connect to one electrode on an element, and the receive channel may connect to an opposite electrode on the element. The separate signal traces on each element allow the element to isolate the transmit and receive paths. A multi-dimensional array is provided for time division multiplex processing. A probe houses the multi-dimensional array and a multiplexer. The multi-dimensional array has a different distribution of elements along different dimensions, such as a 1.5 D array, a split bullet array, a multilayer linear array, or an I beam or +beam array formed from two or more linear arrays. The multiplexer enables operation of complex arrays for various ultrasound processes.
A multi-dimensional transducer array for ultrasound imaging, the array comprising:
A method of manufacturing a multi-dimensional ultrasound transducer array, the method comprising:
The method of 12 wherein (a) comprises simultaneously dicing through first and second layers of flexible circuit material separated by piezoelectric material of the first module, and (b) comprises simultaneously dicing through third and fourth layers of flexible circuit material separated by piezoelectric material of the second module, wherein (a) and (b) are one of simultaneous acts and acts occurring at different times.
A multi-dimensional transducer array for ultrasound imaging, the array comprising:
A multi-dimensional transducer array for ultrasound imaging, the array comprising:
A multi-dimensional transducer array for ultrasound imaging, the array comprising:
Dependencies are inferred from the claim text.