System and method for improved transducer thermal design using thermo-electric cooling

A method of cooling an ultrasound transducer, comprising:

• providing a transducer mounted in a housing, said transducer operable to transmit ultrasonic energy along a path, said transducer comprising a plurality of component layers, each of said component layers separated by a heat conductive layer;
• coupling, thermally, a thermo-electric cooler, mounted in said housing and positioned outside of said path, with said heat conductive layer;
• and
• removing, actively, heat generated by said transducer by active thermal transport of heat energy directly from said heat conductive layer.

An ultrasound transducer assembly, comprising:

• a housing;
• a transducer mounted in said housing, said transducer operable to transmit ultrasonic energy along a path, said transducer comprising a substrate, said substrate having at least one micro-mechanical ultrasound element thereon;
• and
• a thermo-electric cooler mounted in said housing and positioned outside of said path, said thermo-electric cooler being thermally coupled with said substrate for actively removing heat generated by said transducer by active thermal transport of heat energy directly from said substrate.