Method and system for forming a semiconductor device

A method of forming a semiconductor device comprising:

• providing a flexible substrate material;
• depositing a first layer of material over the flexible substrate;
• and
• depositing a layer of resist over the first layer of material;
• utilizing a stamping tool to form a 3D pattern in the layer of resist;
• curing the layer of resist thereby forming a 3D resist structure over the first layer of material wherein the 3D resist structure comprises a plurality of different vertical height wherein at least one height is substantially different from another height;
• and
• utilizing the 3D resist structure to create a cross-point array on the flexible substrate.

A system for forming a semiconductor device comprising:

• means for depositing a first layer of material over a flexible substrate;
• means for depositing a layer of resist over the flexible substrate;
• means for transferring a 3D pattern to the layer of resist to form a 3D layer of resist over the first layer of material wherein the 3D pattern comprises a plurality of different vertical height wherein at least one height is substantially different from another height;
• and
• means for utilizing the 3D layer of resist to form a cross-point array over the flexible substrate.

A method of forming a device comprising:

• providing a substrate;
• depositing a first layer of material over the substrate;
• and
• forming a 3-dimensional (3D) resist structure over the substrate wherein the 3D resist structure comprises a plurality of different vertical heights throughout the structure.

A method of forming a device comprising:

• providing a flexible substrate material;
• depositing a first layer of material over the flexible substrate;
• and
• depositing a layer of resist over the first layer of material;
• utilizing a stamping tool to form a 3D pattern in the layer of resist;
• curing the layer of resist thereby forming a 3D resist structure over the first layer of material wherein the 3D resist structure comprises a plurality of different vertical height wherein at least one height is substantially different from another height;
• and
• utilizing the 3D resist structure to create a cross-point array on the flexible substrate.

A system for forming a device comprising:

• means for depositing a first layer of material over a flexible substrate;
• means for depositing a layer of resist over the flexible substrate;
• means for transferring a 3D pattern to the layer of resist to form a 3D layer of resist over the first layer of material wherein the 3D pattern comprises a plurality of different vertical height wherein at least one height is substantially different from another height;
• and
• means for utilizing the 3D layer of resist to form a cross-point array over the flexible substrate.