Microelectronic assembly with die support and method
OwnerSteven M. Scheifers, Andrew Skipor +1inventors
InventorsSteven M. Scheifers, Andrew Skipor, Daniel Gamota
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Abstract
A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface and an integrated circuit die having a die face and a plurality of bond pads of the die face. The die is provided with a polymeric bead about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a reflow temperature. Exposure of the polymeric bead to the reflow temperature causes the bead to form a peripheral bond between the die and the substrate.
Claims12
A method of forming a microelectronic assembly comprising:
- providing a substrate having a plurality of bond pads;
- providing an integrated circuit die component having at least one edge and a die face with a plurality of solder bumps disposed on the die face;
- forming a bead on at least one outer edge of the die, the bead being made of a polymeric precursor material;
- superimposing the die face over the substrate so that each solder bump contacts a corresponding one of the plurality of bond pads and wherein the die face is spaced apart from the substrate by a gap;
- heating the die and the substrate to a temperature sufficient to reflow the solder bumps to form solder connections to corresponding bond pads, and to flow the polymeric precursor material onto the substrate.
A method of forming a microelectronic assembly comprising:
- providing a substrate having a plurality of bond pads;
- providing an integrated circuit die component having at least one edge and a die face with a plurality of solder bumps disposed on the die face;
- applying a bead on at least one edge of the die, the bead being made of a polymeric precursor material adapted to flow at an elevated temperature;
- superimposing the die face over the substrate so that each solder bump contacts a corresponding one of the plurality of bond pads and wherein the die face is spaced apart from the substrate by a gap;
- heating the die and the substrate to a temperature sufficient to reflow the solder bumps to form connections to corresponding bond pads, and to concurrently cause the polymeric precursor material to flow into the gap and cure to form an encapsulant;
- wherein the encapsulant protects the connection between the bond pads and the solder bumps.
A method of forming a microelectronic assembly comprising the steps of:
- providing a semiconductor wafer having a wafer face, the wafer face having at least one integrated circuit die component formed thereon, each die component including a die face, a plurality of solder bumps disposed on the die face and a plurality of edges;
- placing the semiconductor wafer onto an adhesive backing material with the wafer face facing outwardly from the adhesive backing material;
- forming streets around each of the die components;
- filling the streets with a polymeric precursor material;
- separating the die components, each of the die components including a bead formed of the polymeric precursor material, the bead located on at least one of the edges of each of the die components;
- providing a substrate having a plurality of bond pads;
- superimposing the die face over the substrate so that each solder bump contacts a corresponding one of the plurality of bond pads;
- heating the die component and the substrate to a temperature sufficient to reflow the solder bumps to form solder connections to corresponding bond pads and to flow the polymeric precursor material onto the substrate.
A microelectronic assembly comprising:
- a substrate having a plurality of bond pads on a die attach surface;
- an integrated circuit die component having at least one edge and a die face, the die face being adjacent the die attach surface, a plurality of bond pads being formed on the die face and electrically connected to the bond pads of the substrate;
- and
- a polymeric bead formed of polymeric precursor material located on at least one of the edges of the integrated circuit die component and making contact between at least one of the edges of the integrated circuit die component and a corresponding portion of the die attach surface of the substrate.
Dependencies are inferred from the claim text.