Multilayer stripline radio frequency circuits and interconnection methods
AssigneeRaytheon Company
InventorsAngelo Puzella, Joseph M. Crowder, Patricia S. Dupuis, Michael C. Fallica
Life of this patent
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Abstract
A multi-layer stripline assembly interconnection includes a first stripline sub-assembly having a first surface and a first plurality of vias disposed in the first surface adapted to receive a plurality of solid metal balls. The interconnection further includes a second stripline sub-assembly having a second plurality of vias disposed in the first surface of the second sub-assembly adapted to be aligned with the first plurality of vias. Reflowed solder is wetted to the second plurality of vias and to the corresponding plurality of solid metal balls.
Claims21
A method for interconnecting multilayer stripline radio frequency (RF) circuits comprising:
- providing a first stripline sub-assembly, the first stripline sub-assembly having a first plurality of vias disposed on a first surface of the first stripline sub-assembly;
- providing a second stripline sub-assembly, the second stripline sub-assembly having a second plurality of vias disposed on a first surface of the second stripline sub-assembly;
- depositing a volume of solder into selected ones of the first plurality of vias;
- depositing each of a plurality of solid metal balls into selected ones of the first plurality of vias;
- re-flowing the volume of solder on the first stripline sub-assembly at a first temperature such that each of the plurality of solid metal balls is in fluid contact with a corresponding one of the first plurality of vias;
- disposing a epoxy sheet on the first surface of the second stripline sub-assembly;
- dispensing conductive epoxy into selected ones of the second plurality of vias;
- and
- bonding the first surface of the first stripline sub-assembly to the first surface of the second stripline sub-assembly at a second temperature such that the epoxy sheet is set and wherein the second temperature is lower than the first temperature.
A method of interconnecting multilayer stripline radio frequency (RF) circuits comprising:
- providing a first stripline sub-assembly, the first sub-assembly having a first plurality of vias, disposed on a first surface;
- providing a second stripline sub-assembly, the second sub-assembly having a second plurality of vias, disposed on a first surface;
- applying solder to the first plurality of vias;
- providing a plurality of solid metal balls;
- re-flowing the solder on the first stripline sub-assembly;
- placing conductive epoxy sheet on the first surface of the second stripline sub-assembly;
- dispensing conductive epoxy into the second plurality of vias;
- aligning the first surface of the first stripline sub-assembly with the first surface of the second stripline sub-assembly such that each of the plurality of solid metal balls is adjacent a corresponding one of the second plurality of vias;
- and
- bonding the first surface of the first stripline sub-assembly to the first surface of the second stripline sub-assembly.
A multi-layer stripline assembly interconnection comprising:
- a first stripline sub-assembly having a first surface;
- a first plurality of vias disposed in the first surface of the first stripline sub-assembly;
- a first plurality of solid metal balls, each disposed in a respective one of the first plurality of vias;
- a second stripline sub-assembly having a first surface;
- a second plurality of vias disposed in the first surface of the second sub-assembly adapted to be aligned with the corresponding first plurality of solid metal balls;
- and
- reflowed solder wetted to the second plurality of vias and to the first plurality of solid metal balls.
An interconnection comprising:
- a first via disposed in a first sub-assembly;
- a second via disposed in a second sub-assembly;
- a metal ball disposed between the first via and second via and adapted for electrically connecting the first via with the second via.
Dependencies are inferred from the claim text.