Substrate enhancement for improved signal characteristics on a discontinuous transmission line
AssigneeHarris Corporation
InventorsRaymond Charles Rumpf JR., William D. Killen, Randy T. Pike
Life of this patent
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AssigneeHarris Corporation
InventorsRaymond Charles Rumpf JR., William D. Killen, Randy T. Pike
Estimating the term…
A circuit for processing radio frequency signals. The circuit can include a substrate board that has at least one dielectric layer (100) having a first set of substrate properties over a first region (102). The first set of substrate properties can include a first permittivity and a first permeability. A second region (140) can be provided with a set of second substrate properties. The second region can have a second set of substrate properties including a second permittivity and a second permeability. The second permittivity can be different than the first permittivity and/or the second permeability can be different than the first permeability. A first transmission line (102) having at least one discontinuity can be coupled to the second region (108). The discontinuity can include a bend, corner, non-uniformity, break in the transmission line, or a junction between the first transmission line and a second transmission line.
A circuit for processing radio frequency signals, comprising:
Dependencies are inferred from the claim text.