Transmission line structure for reduced coupling of signals between circuit elements on a circuit board
AssigneeHarris Corporation
InventorsWilliam D. Killen, Randy T. Pike
Life of this patent
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AssigneeHarris Corporation
InventorsWilliam D. Killen, Randy T. Pike
Estimating the term…
A transmission line structure for reduced coupling of signals between circuit elements. The structure includes an RF transmission line disposed on a circuit board (100) formed from a dielectric substrate material. The RF transmission line includes an elongated conductive metal trace (110) and has opposed elongated edge portions. The structure also includes a pair of elongated substrate boundary regions (105) coextensive with at least a portion of the elongated conductive metal trace (110). Each of the boundary regions (105) is positioned adjacent to a respective one of the opposing edge portions to define an elongated substrate channel region (205). A pair of conductive metal traces (410) can be disposed on the substrate channel region (205) within the substrate boundary regions (105). The conductive metal traces (410) are spaced apart by an intermediate substrate region (405) and are parallel to each other. The intermediate region (405) has a different permittivity than a permittivity of the substrate channel region (205).
A transmission line structure for reduced coupling of signals between circuit elements on a circuit board, comprising:
Dependencies are inferred from the claim text.