Integrated passive devices fabricated utilizing multi-layer, organic laminates

An organic bandpass filter, comprising:

• a protective layer having an upper surface and a lower surface;
• a core layer having an upper surface and a lower surface, wherein the core layer and the protective layer are position opposite one another so that the lower surface of the protective layer is facing the upper surface of the core layer;
• an organic dielectric layer having at least two resonators, wherein two of the resonators are coupled to each other, the organic dielectric layer being arranged between the core layer and the protective layer;
• a first shield electrode on the lower surface of the core layer opposite the organic dielectric layer;
• a side shield electrode in electrical contact with the first shield electrode;
• a plurality of solder balls on the protective layer;
• and
• through holes that electrically connect at least one solder ball to the first shield electrode.

A stand-alone organic passive device, comprising:

• a first core layer having an upper surface and a lower surface;
• a second core layer having an upper surface and a lower surface, wherein the first core layer and the second core layer are position opposite one another so that the lower surface of the first core layer is facing the upper surface of the second core layer;
• an organic dielectric layer having at least on passive device, the organic dielectric layer being arranged between the first core layer and the second core layer;
• a first shield electrode on the upper surface of the first core layer opposite the organic dielectric layer;
• a second shield electrode on the lower surface of the second core layer opposite the organic dielectric layer;
• and
• a side shield electrode in electrical contact with the first and second shield electrodes.

A stand-alone organic passive device, comprising:

• a protective layer having an upper surface and a lower surface;
• a core layer having an upper surface and a lower surface, wherein the core layer and the protective layer are position opposite one another so that the lower surface of the protective layer is facing the upper surface of the core layer;
• an organic dielectric layer having at least one passive device, the organic dielectric layer being arranged between the core layer and the protective layer;
• a first shield electrode on the lower surface of the core layer opposite the organic dielectric layer;
• a side shield electrode in electrical contact with the first shield electrode;
• a plurality of solder balls on the protective layer;
• and
• through holes that electrically connect at least one solder ball to the first shield electrode.