Low profile temperature-compensated low-stress crystal mount structure
OwnerPeter E. Morley, Daniel S. Stevensinventors
Life of this patent
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Abstract
A temperature compensated mounting structure, such that the stress applied to the resonator element by the mounting is minimized over a wide range of temperatures. This compensation significantly reduces or eliminates residual stresses from earlier process stages, such as cement curing, as well as stresses induced by ambient temperature changes. The entire structure is designed to be stress-free by the selection of materials and the dimensions of the elements. The geometry of the structure and the choice of materials are selected based on their linear and higher order expansion coefficients so as to minimize the forces between the resonator element and the mount resulting from temperature changes.
Claims18
A temperature compensated mounting package, comprising:
- a base element having a base thermal expansion coefficient M1;
- a resonator having a resonator thermal expansion coefficient M2, wherein L3 is an approximate distance from a midpoint of said resonator to an outer edge of said resonator;
- at least two clips each having a clip thermal expansion coefficient M3, wherein said clips are coupled to said resonator at said outer edge and coupled to said base at a base connection;
- and wherein said thermal expansion coefficient M1, M2, and M3, said dimension L3, and a location of said base connection are designed such that a residual stress of said package is zero.
A method for manufacturing a temperature compensated resonator structure, comprising the steps of:
- forming a substantially planar base with a base material having a thermal expansion coefficient M1;
- forming a substantially planar resonator with a resonator material having a thermal expansion coefficient M2;
- forming at least two clips with a clip material having a thermal expansion coefficient M3;
- calculating a stress-free structure based on said thermal expansion coefficient M1, M2 and M3, a length of said resonator and a placement of said clip onto said base;
- and
- affixing said clips between said resonator and said base.
A thermal stress-free mounting structure, comprising:
- a base element having a base thermal expansion coefficient M1;
- a substantially planar resonator having a resonator thermal expansion coefficient M2, wherein L3 is an approximate distance from a midpoint of said resonator to an outer edge of said resonator;
- at least two clips each having a clip thermal expansion coefficient M3, wherein said clips are coupled to said resonator at said outer edge and coupled to said base at a base connection;
- and
- a means for calculating said stress-free structure, wherein said means comprises processing according to said M1, M2, M3, L3 and placement of said clips on said base.
Dependencies are inferred from the claim text.