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US 2004/0000726 A1Published application
Pad arrangement method for reducing bonding failures and signal skew
AssigneeSamsung Electronics Co., Ltd.
InventorsHo-Cheol Lee, Jae-Hoon Kim, Jung-Su Ryu
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Abstract
A variety of pad arrangements are provided for semiconductor devices for reducing the likelihood of bonding failures, particularly those due to shorts, and/or for reducing the difference in length between bonding wires to decrease signal skew during operation of the semiconductor device and improve signal integrity.
Claims22
A semiconductor device having a plurality of bond pads comprising:
- a first series of bond pads, the first series of bond pads generally aligned along a first axis, the first axis forming first angle α with a first edge of the semiconductor device;
- and
- a second serried of bond pads, the second series of bond pads generally aligned along a second axis, the second axis forming second angle β with the first edge of the semiconductor device.
A semiconductor device having a plurality of bond pads comprising:
- a plurality of bond pad pairs, each pair of bond pads including a first bond pad and a second bond pad, wherein
- each of the first bond pads is positioned at a first distance measured perpendicularly from a first edge of the semiconductor device and
- each of the second bond pads is positioned at a second distance measured perpendicularly from the first edge of the semiconductor device and separated from a corresponding first bond pad by an offset distance measured in a direction substantially parallel to the first edge of the semiconductor device,
- the first and second perpendicular distances being unequal.
1 more element
Dependencies are inferred from the claim text.