IC substrate with over voltage protection function and method for manufacturing the same

An IC substrate with over voltage protection functions, comprising:

• a substrate;
• one or more variable resistance material layers disposed on a lower surface of the substrate;
• a grounding conductor layer for forming a grounding terminal, said grounding terminal being disposed on the lower surface of the substrate and extending to overlay each of the variable resistance material layers so as to form a connection with each of the variable resistance material layers;
• and
• a plurality of conductor layers for forming electrode terminals, each of the conductor layers being disposed on an upper surface of the substrate and connected with each of the variable resistance material layers.

An IC substrate with over voltage protection functions, comprising:

• a substrate;
• a grounding conductor layer for forming a grounding terminal, said grounding terminal being disposed on the lower surface of the substrate;
• one or more variable resistance material layers disposed through the substrate and connected with the grounding conductor layers;
• and
• a plurality of conductor layers for forming electrode terminals, each conductor layer being disposed on an upper surface of the substrate and overlaying each of the variable resistance material layers, and connected with each of the variable resistance material layers.

An IC substrate with over voltage protection functions, comprising:

• a first substrate;
• one or a plurality of the grounding conductor layers for forming a grounding terminal, said grounding terminal being disposed on a lower surface of the first substrate and extending to an upper surface of the first substrate, thereby one or a plurality of terminals is formed on the upper surface of the first substrate;
• one or more variable resistance material layers disposed on the terminals exposed on the grounding conductor layer and connected with each of the grounding layers;
• a plurality of first conductor layers disposed on the substrate and overlaying on each of the variable resistance material layers so as to be connected with each of variable resistance material layers, the plurality of the first conductor layers being disposed through the first substrate, thereby terminals of the first conductor layers is exposed on the upper and lower surfaces of the first substrate;
• a second substrate disposed on the upper surface of the first substrate;
• and
• a plurality of the second conductor layers for forming electrode terminals, which are disposed through the second substrate and connected with the first conductor layers on the first substrate, and a terminal of the second conductor layer being exposed on an upper surface of the second substrate.

An IC substrate with over voltage protection functions, comprising:

• a first substrate;
• a plurality of the first grounding conductor layers disposed through the first substrate, thereby terminals of the first grounding conductor layers being exposed on an upper surface and a lower surface of the first substrate;
• a second substrate disposed on the first substrate;
• a plurality of the second conductor layers disposed through the second substrate, thereby terminals of the second conductor layers being exposed on an upper surface and a lower surface of the second substrate, wherein the terminals exposed on the lower surface of the second substrate are connected with the first conductor layers exposed on the upper surface of the first substrate;
• a grounding conductor layer for forming a grounding terminal disposed on the lower surface of the second substrate;
• one or more variable resistance material layers disposed through the second substrate, so that lower portion terminals of the variable resistance material layers is connected with the grounding conductor layer and upper terminals of the variable resistance material layers are exposed on the upper surface of the second substrate;
• a third substrate disposed on the upper surface of the second substrate;
• and
• a plurality of the third conductor layers for forming electrode terminals through the third substrate, the terminals exposed on a lower surface terminals of the third substrate being connected with the second conductor layers of the second substrate, and terminals of the third conductor layers being exposed on the upper surface of the third substrate.

A ball grid array (BGA) IC package with over voltage protection functions, comprising:

• a BGA IC package having a substrate;
• a plurality of grounding conductor layers for forming grounding terminals and disposed on a surface of the BGA IC package;
• one or more variable resistance material layers overlaying on the grounding conductor layers and connected with them;
• and
• a plurality of electrode materials, wherein the variable resistance material layers are connected with the plurality of the electrode terminals and the plurality of grounding conductor layers.

A method for manufacturing an IC substrate with over voltage protection functions, comprising the following steps:

• forming a first conductor layer to be a grounding conductor layer on a substrate, wherein the first conductor layer is formed on a lower surface of the substrate and extends through the substrate to its upper surface, thereby to expose one or more terminals of the first conductor layer on the upper surface of the substrate;
• forming one or more variable resistance material layers for overlaying the exposed terminals of the grounding conductor layer and connected with each of the first conductor layers;
• and
• forming a plurality of second conductor layers to be upper electrodes, said second conductor layers extending to overlay the variable resistance material layers and connected with each of the variable resistance material layers.

A method for manufacturing an IC substrate with over voltage protection functions, comprising the following steps:

• forming a conductor layer on a surface of a substrate;
• etching the conductor layer into a desired shape to be a grounding conductor layer;
• forming one or more desired holes through the substrate;
• flipping the substrate and filling the holes with variable resistance material layers;
• and
• forming a plurality of upper electrodes on a surface of the substrate opposite to the conductor layer, wherein the upper electrodes overlay on each of the variable resistance material layers.

A method for manufacturing an IC substrate with over voltage protection functions. comprising the following steps:

• forming one or more grounding conductor layers on a first substrate to be grounding terminals, which extend through the first substrate and are disposed on a lower surface of the first substrate, thereby to expose one or more terminals on an upper surface of the first substrate;
• forming one or more variable resistance material layer on the first substrate to overlay the terminals of the grounding conductor layers so as to form connections with each of the grounding conductor layers;
• forming a plurality of the first conductor layers on the upper surface of the first substrate, wherein each of the conductor layers overlays each of the variable resistance material layers so as to be connected with each of the variable resistance material layers, and the plurality of the first conductor layer extend through the first substrate to expose terminals on the upper and lower surfaces of the first substrate;
• forming a plurality of second conductor layers on a second substrate to be electrode terminals, wherein the plurality of the conductor layers extend through the second substrate to expose terminals on the upper surface of the second substrate;
• and
• disposing the second substrate on the upper surface of the first substrate, wherein the first conductor layers are connected with the second conductor layers.

A method for manufacturing an IC substrate with over voltage protection functions, comprising the following steps:

• forming a plurality of first conductor layers on a first substrate, wherein each of the first conductor layers extends through the first substrate to expose terminals on an upper surface and a lower surface of the first substrate;
• forming a plurality of second conductor layers on a second substrate, wherein the second conductors layers extend through the second substrate and to expose terminals of the second conductor layers on the upper surface and lower surface of the second substrate;
• forming holes on the second substrate and filling the holes with one or more variable resistance material layers, wherein the variable resistance material layers extend through the second substrate, the upper portion of the variable resistance material layers is exposed on the second substrate to be terminals;
• forming a grounding conductor layer on the lower surface of the second substrate to be a grounding terminal;
• disposing the second substrate on the first substrate, wherein lower portions of the variable resistance material layers are connected with the grounding conductor layer, and the terminals of the lower surface of the variable resistance material layers are connected with the upper surface of the first substrate;
• forming a plurality of third conductor layers on a third substrate to be electrode terminals, wherein the third conductor layers extend through the third substrate to expose terminals of the third conductor layers on an upper surface and a lower surface of the third substrate;
• and
• disposing the third substrate on the second substrate, wherein each of the third conductor layers is connected with the variable resistance material layers and the terminals exposed on the second conductor layer.

A method for manufacturing a ball grid array (BGA) IC package with over voltage protection functions, comprising the following steps:

• forming a plurality of grounding conductor layers on a BGA IC package to be grounding terminals, wherein each of the terminals is disposed on a surface of the BGA IC package;
• forming one or more variable resistance material layers on the plurality of grounding conductor layers, wherein each of the variable resistance material layers are disposed on terminals of the grounding conductor layers and connected with each of the grounding conductor layers;
• and
• a plurality of electrode terminals, wherein the variable resistance material layers are connected with the plurality of electrode terminals and the plurality of grounding conductor layers.