Common connection method for flip-chip assembled devices
AssigneeLucent Technologies Inc.
InventorsVladimir Anatolyevich Aksyuk, Dustin W. Carr, Flavio Pardo
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Abstract
The planes of chips in a flip-chip arrangement, when at least one of the chips has an insulating layer running through it, may be electrically connected together by incorporating into the top chip a flexible metalized structure which is pinned to the top layer of the bottom chip using a wire bond ball which is connected to a wire that is attached to a pad on the top layer of the upper chip. A single connection connects both layers of the top chip to the layer on the bottom chip. The flexible structure may be similar to a collapsible cup with a hole in the middle or it may be a tiltable micro mirror.
Claims24
A flip-chip assembly in which a top chip and a bottom chip are connected, at least said top chip having an insulating layer therethrough, comprising:
- a flexible structure which is electrically coupled to a bottom layer of said top chip;
- and
- a wire bond which pins at least a conductive portion of said flexible structure to a top layer of said bottom chip, said top layer of said bottom chip facing said bottom layer of said top chip when said flip-chip is assembled.
A flip-chip assembly in which a top chip and a bottom chip are connected, at least said top chip having an insulating layer therethrough, said flip-chip assembly comprising a flexible structure which is electrically coupled to a bottom layer of said top chip;
- and is adapted to be pinned by a wire bond to at least a conductive portion of said flexible structure to a top layer of said bottom chip, said top layer of said bottom chip facing said bottom layer of said top chip when said flip-chip is assembled.
A method for use in assembling a flip-chip in which a top chip and a bottom chip are connected, at least said top chip having an insulating layer therethrough, the method comprising the step of pinning at least a conductive portion of a flexible structure which is electrically coupled to a bottom layer of said top chip to a top layer of said bottom chip using a wire bond.
Apparatus in a flip-chip assembly in which a top chip and a bottom chip are connected, at least said top chip having an insulating layer therethrough, comprising:
- means for pinning at least a conductive portion of a flexible structure which is electrically coupled to a bottom layer of said top chip to a top layer of said bottom chip using a wire bond;
- and
- means for connecting said wire bond to a top layer of said top chip.
Apparatus in a flip-chip assembly in which a top chip and a bottom chip are connected, at least said top chip having an insulating layer therethrough, comprising:
- means, electrically coupled to a bottom layer of said top chip, which is adapted to be extended toward a top layer of said bottom chip;
- and
- means for electrically bonding said means which is adapted to be extended to a top layer of said top chip.
Dependencies are inferred from the claim text.