Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
AssigneeArbor Company LLP
InventorsJon M. Huppenthal, D. James Guzy
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Abstract
A reconfigurable processor module comprising hybrid stacked integrated circuit (“IC”) die elements. In a particular embodiment disclosed herein, a processor module with reconfigurable capability may be constructed by stacking one or more thinned microprocessor, memory and/or field programmable gate array (“FPGA”) die elements and interconnecting the same utilizing contacts that traverse the thickness of the die. The processor module disclosed allows for a significant acceleration in the sharing of data between the microprocessor and the FPGA element while advantageously increasing final assembly yield and concomitantly reducing final assembly cost.
Claims47
A processor module comprising:
- at least a first integrated circuit die element including a programmable array;
- and
- at least a second integrated circuit die element stacked with and electrically coupled to said programmable array of said first integrated circuit die element.
A reconfigurable computer system comprising:
- a processor;
- a memory;
- and
- at least one processor module including at least a first integrated circuit die element having a programmable array and at least a second integrated circuit die element stacked with and electrically coupled to said programmable array of said first integrated circuit die element.
A processor module comprising:
- at least a first integrated circuit die element including a programmable array;
- at least a second integrated circuit die element including a processor stacked with and electrically coupled to said programmable array of said first integrated circuit die element;
- and
- at least a third integrated circuit die element including a memory stacked with and electrically coupled to said programmable array and said processor of said first and second integrated circuit die elements respectively.
A programmable array module comprising:
- at least a first integrated circuit die element including a field programmable gate array;
- and
- at least a second integrated circuit die element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit die element.
A reconfigurable processor module comprising:
- at least a first integrated circuit die element including a programmable array;
- at least a second integrated circuit die element including a processor stacked with and electrically coupled to said programmable array of said first integrated circuit die element;
- and
- at least a third integrated circuit die element including a memory stacked with and electrically coupled to said programmable array and said processor of said first and second integrated circuit die elements respectively
- whereby said processor and said programmable array are operational to share data therebetween.
A programmable array module comprising:
- at least a first integrated circuit die element including a field programmable gate array;
- and
- at least a second integrated circuit die element including a memory array stacked with and electrically coupled to said field programmable gate array of said first integrated circuit die element, said first and second integrated circuit die elements being coupled by a number of contact points distributed throughout the surfaces of said die elements.
Dependencies are inferred from the claim text.