Semiconductor package body having a lead frame with enhanced heat dissipation

A semiconductor package body having a lead frame, the lead frame electrically connected to a semiconductor chip via at least one bonding wire in the semiconductor package body, the lead frame comprising:

• a die pedestal encapsulated in the semiconductor package body and having a first surface and a second surface opposite each other, in which the semiconductor chip is disposed on the first surface of the die pedestal;
• two base pads disposed outside the die pedestal;
• at least one connecting part encapsulated in the semiconductor package body and providing a connection between the die pedestal and the base pads;
• and
• a plurality of leads, wherein each lead has an electrical connecting portion and a connecting foot portion, the electrical connecting portion is electrically connected to the semiconductor chip via the bonding wire, and the connecting foot portion is exposed to the exterior of the semiconductor package body.