Integrated circuit and laminated leadframe package
AssigneeSemiconductor Components Industries, LLC
InventorsJames Knapp, Stephen St. Germain
Life of this patent
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Abstract
An integrated circuit (100) includes a semiconductor die (102, 103) and a semiconductor package (101) that has a leadframe (20, 40, 60, 80) for mounting the semiconductor die. The leadframe includes a first laminate (20) whose bottom surface (7) is patterned with leads (106, 107, 131, 132) of the integrated circuit. A second laminate (40) has a bottom surface (3) attached to a top surface (5) of the first laminate to electrically coupling the leads to the semiconductor die.
Claims18
An integrated circuit, comprising:
- a first semiconductor die;
- and
- a leadframe for mounting the first semiconductor die, including
- a first laminate having a bottom surface formed with a lead of the integrated circuit, and
- a second laminate having a bottom surface attached to a top surface of the first laminate for electrically coupling the lead to the first semiconductor die.
A semiconductor package, comprising a leadframe for mounting a semiconductor die, the leadframe including
- a first conductive laminate having a bottom surface patterned for making external electrical connections;
- and
- a second conductive laminate attached to a top surface of the first laminate and providing a signal path from the semiconductor die to the first conductive laminate.
A semiconductor device, comprising:
- a semiconductor die;
- and
- a leadframe formed as stacked conductive laminates for mounting the semiconductor die, one of the stacked conductive laminates patterned to form an external lead of the semiconductor device and another of the stacked conductive laminates patterned for electrically coupling a bonding pad of the semiconductor die to the external lead.
Dependencies are inferred from the claim text.