Stand-alone organic-based passive devices

An organic inductor device for mounting to a circuit board, comprising:

• a first conductive layer;
• a first substrate layer comprising an organic material formed on a first surface of the first conductive layer;
• a second conductive layer formed on a first surface of the first substrate layer and comprising an inductor, which exposes portions of the first substrate layer;
• a bond ply layer formed on the second conductive layer and exposed portions of the first substrate layer;
• a second substrate layer comprising a second organic material formed on the bond ply layer opposite the second conductive layer and first substrate layer;
• shielding on at least two opposite sides of the inductor device;
• and
• wherein the inductor is configured in a coplanar waveguide/microstrip topology.

An organic stand-alone inductor device, comprising:

• a device component comprising a first organic substrate on which at least one inductor is formed;
• a first core layer of organic material adjacent the device component;
• and
• side shielding on at least two sides of the inductor to provide a single ground reference.

A method for fabricating a stand-alone inductor device, comprising:

• fabricating a wafer comprising a plurality of all organic inductor devices, at least one inductor device comprising:
• a device component including a first organic substrate on which at least one inductor is formed, and
• a first core layer of organic material adjacent the device component;
• forming trenches along two opposing sides of at least one inductor device integrated in the wafer;
• metalizing the trenches;
• and
• singulating the inductor devices so as to form stand-alone inductor devices with external side shielding formed from the metallization of the trenches.

A method for fabricating a stand-alone inductor device, comprising:

• fabricating a wafer comprising a plurality of all organic inductor devices, at least one inductor device comprising:
• a device component including a first organic substrate on which at least one inductor is formed,
• in-built side shielding on at least two sides of an inductor integral the inductor device;
• and
• a first core layer of organic material adjacent the device component;
• forming trenches along two opposing sides of at least one inductor device integrated in the wafer;
• and
• singulating the inductor devices so as to form stand-alone inductor devices.