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US 2004/0000687 A1Published application
Ferroelectric capacitors with metal oxide for inhibiting fatigue and methods of forming the same
AssigneeSamsung Electronics Co., Ltd.
InventorsMoon-Sook Lee, Kun-Sang Park
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Abstract
A method of forming a ferroelectric capacitor includes forming a lower electrode on a substrate. The lower electrode is oxidized to form a metal oxide film. A ferroelectric film is formed on the metal oxide film while reduction of the oxygen content of the metal oxide film is inhibited. An upper electrode is formed on the ferroelectric film.
Claims26
A method of forming a ferroelectric capacitor, the method comprising the steps of:
- forming a lower electrode on a substrate;
- oxidizing the lower electrode to form a metal oxide film on the lower electrode;
- forming a ferroelectric film on the metal oxide film while inhibiting reduction of oxygen content of the metal oxide film;
- and
- forming an upper electrode on the ferroelectric film.
2 more elements
A method of forming a semiconductor device, the method comprising the steps of:
- forming a MOS transistor on a substrate;
- forming an interlayer insulating layer on the substrate and the MOS transistor;
- forming a contact plug penetrating the interlayer insulating layer and electrically connected with a source region of the MOS transistor;
- forming a stack type lower electrode on the interlayer insulating layer and that is electrically connected with the contact plug;
- oxidizing the lower electrode to form a metal oxide film on an upper surface and sidewall surfaces of the lower electrode;
- forming a ferroelectric film on the metal oxide film while providing oxygen to the metal oxide film;
- and
- forming an upper electrode on the ferroelectric film.
5 more elements
A ferroelectric capacitor comprising:
- a lower electrode on a substrate, the lower electrode comprising a metal film in which a surface portion of the metal film is oxidized as a metal oxide film;
- a ferroelectric film on the metal oxide film and the substrate;
- and
- an upper electrode on the ferroelectric film.
1 more element
A semiconductor device comprising:
- a MOS transistor on a substrate;
- an interlayer insulating layer on the substrate and the MOS transistor;
- a contact plug that penetrates the interlayer insulating layer and is electrically connected with a source region of the MOS transistor;
- a stack type lower electrode on the interlayer insulating layer and electrically connected with the contact plug, the lower electrode comprising a metal film in which an upper surface and sidewall surface portions of the metal film are oxidized as a metal oxide film;
- a ferroelectric film on the metal oxide film and the interlayer insulating layer;
- and
- an upper electrode on the ferroelectric film.
4 more elements
Dependencies are inferred from the claim text.