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AssigneeSony Corporation
InventorIkuhiro Yamamura
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To arrange diffusion-inhibitory films 5a, 5b, and 5c for inhibiting the diffusion of a wiring material absent in a region on or above a light receiving unit 2, the diffusion-inhibitory films 5a, 5b, and 5c formed on a region above the light receiving unit 2 are selectively removed. Alternatively, the diffusion-inhibitory films are arranged only on top surfaces of wirings 4a, 4b, and 4c, and only a passivation film 12 and interlayer insulating films 3a, 3b, and 3c are arranged in the region on or above the light receiving unit 2. Thus, with less interface between different insulation films and less reflection of incident light in an incident region, the incident light 13 highly efficiently passes through these insulating films and comes into the light receiving unit 2. The light receiving unit 2 can thereby receive a sufficient quantity of the incident light 13.
A solid-state imaging device comprising:
A solid-state imaging apparatus, comprising:
A method for manufacturing the solid-state imaging device, comprising the steps of:
A method for manufacturing a solid-state imaging apparatus, the method comprising the steps of:
A Solid-state imaging apparatus having a light receiving unit and a peripheral circuit formed on a substrate, comprising:
Dependencies are inferred from the claim text.