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AssigneeKabushiki Kaisha Shinkawa
InventorsShinichi Nishiura, Mitsuaki Sakakura, Fumio Miyano
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An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that contains, for instance, tin; and a direct-current high voltage power supply. When the direct-current high voltage power supply is turned ON, a space discharge occurs between the tip end of the wire and the torch electrode, resulting in that the wire tip end melts and is formed into a ball and that the tin of the torch electrode is also heated to a high temperature and diffused into space, so that ionized plus tin ions are attracted to the tip end of the melted wire, thus causing tin to adhere to the surface of the ball-shaped tip end of the wire, and forming an initial ball that has a low-melting-point coating material adhered to its surface.
An initial ball forming method for a wire used in wire bonding, comprising applying a discharge voltage across a wire and a torch electrode made of a coating material whose melting point is lower than that of said wire, thus melting a tip end of said wire and making a ball shape end, thus forming an initial ball that comprises said ball shape end of which surface being adhered with said coating material.
An initial ball forming method for a wire used in bonding wire, comprising making a ball-form ball base on a tip end of a wire, thus forming an initial ball in which a surface of said ball base is adhered with a coating material whose melting point is lower than that of said wire.
A wire bonding apparatus comprising:
A wire bonding apparatus comprising:
Dependencies are inferred from the claim text.