Wafer shipping device and storage method for preventing fluoridation in bonding pads
AssigneeMacronix International Co., Ltd.
InventorsHung-Wen Lee, Ching-Ping Wu, Yen-Huei Su
Life of this patent
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Abstract
A wafer-shipping device and a wafer storage method for protecting bonding pads from fluoridation. First, at least one through hole is drilled in the shipping box. The wafer is then placed in the shipping box. A packaging bag containing the shipping box is put into a vacuum packaging machine to remove air from the packaging bag and the shipping box. A dry inert gas is then introduced into the packaging bag and the shipping box until approaching atmospheric pressure as so to prevent the shipping box from collapse. The packaging bag is then sealed.
Claims6
A wafer storage method for preventing bonding pad fluoridation, comprising:
- providing a shipping box for a wafer, the shipping box having at least one through hole;
- providing a packaging bag to coantain the shipping box;
- pumping air from the packaging bag and the shipping box;
- introducing a dry inert gas into the packaging bag and the shipping box until approaching atmospheric pressure;
- and
- sealing the packaging bag.
A wafer-shipping device, comprising:
- a shipping box for a wafer, the shipping box having at least one through hole;
- a packaging bag to contain the shipping box;
- and
- a dry inert gas filling the packaging bag and the shipping box, surrounding the wafer.
Dependencies are inferred from the claim text.