Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations
AssigneeUniversity of Southern California
InventorsGang Zhang, Adam L. Cohen
Life of this patent
Estimating the term…
Abstract
Electrochemical fabrication (e.g. EFAB) processes and apparatus are disclosed that provide monitoring of at least one electrical parameter (e.g. voltage) during selective deposition where the monitored parameter is used to help determine the quality of the deposition that was made. If the monitored parameter indicates that a problem occurred with the deposition, various remedial operations may be undertaken to allow successful formation of the structure to be completed.
Claims26
An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:
- (A) selectively depositing at least a portion of a layer onto the substrate, wherein the substrate may comprise previously deposited material;
- (B) forming a plurality of layers such that successive layers are formed adjacent to and adhered to previously deposited layers, wherein said forming comprises repeating operation (A) a plurality of times;
- wherein at least a plurality of the selective depositing operations comprise:
- (1) locating a mask on, or in proximity to, a substrate;
- (2) in presence of a plating solution, conducting an electric current between an anode and the substrate through the at least one opening in the mask, such that a selected deposition material is deposited onto the substrate to form at least a portion of a layer;
- and
- (3) removing the mask from the substrate;
- and
- wherein during formation of a given layer, a voltage between the anode and cathode is monitored.
An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:
- (A) selectively depositing at least a portion of a layer onto the substrate, wherein the substrate may comprise previously deposited material;
- (B) forming a plurality of layers such that successive layers are formed adjacent to and adhered to previously deposited layers, wherein said forming comprises repeating operation (A) a plurality of times;
- wherein at least a plurality of the selective depositing operations comprise:
- (1) locating a mask on, or in proximity to, a substrate;
- (2) in presence of a plating solution, conducting an electric current between an anode and the substrate through the at least one opening in the mask, such that a selected deposition material is deposited onto the substrate to form at least a portion of a layer;
- and
- (3) removing the mask from the substrate;
- and
- wherein during, or after, formation of a given layer, the layer is inspected or formation parameters are compared to anticipated parameter values such that if it is determined that the layer was not formed correctly, at least a portion of material deposited in association with the layer is removed and replacement material is deposited.
A conformable contact masking process for producing a structure, wherein the process comprises:
- (A) supplying at least one preformed mask that comprises a patterned dielectric material that includes at least one opening through which deposition can take place during the formation of at least a portion of a layer, and wherein the at least one mask comprises a support structure that supports the patterned dielectric material;
- and
- (B) selectively depositing at least a portion of a layer onto a substrate, comprising:
- i) contacting the substrate and the dielectric material of the preformed mask;
- ii) in presence of a plating solution, conducting an electric current through the at least one opening in the selected mask between an anode and the substrate such that a selected deposition material is deposited onto the substrate to form at least a portion of a layer;
- and
- iii) separating the selected preformed mask from the substrate;
- and
- wherein during, or after, formation of a given layer, the layer is inspected, or formation parameters are compared to anticipated parameter values, such that if it is determined that the layer was not formed correctly, at least a portion of material deposited in association with the layer is removed and replacement material is deposited.
Dependencies are inferred from the claim text.