Method and system for controlling ion distribution during plating of a metal on a workpiece surface
AssigneeAdvanced Micro Devices, Inc.
InventorsMatthias Bonkass, Axel Preusse
Life of this patent
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Abstract
The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. In another embodiment, the diffuser element comprises at least two patterns of passages that are movable relatively to each other so as to adjust an overlap and thus an effective size of the corresponding passages. Moreover, the path of ions within the plating reactor may be controlled by an electromagnetically driven diffuser element so that a required thickness profile on the workpiece surface may be obtained.
Claims38
A diffuser element for a plating reactor, comprising:
- a plurality of passages;
- and
- an adjustment mechanism configured to adjust an effective size of the passages.
A diffuser element for a plating reactor, comprising a first pattern of openings and a second pattern of openings, wherein the first and second patterns are adjustably attached relative to each other such that a degree of overlap of openings in the first and second patterns is controllable.
A diffuser element for a plating reactor, comprising:
- a deflection unit configured to adjustably control the path of an ion passing through the diffuser element.
A diffusing system for a plating reactor, comprising:
- a diffuser element including a deflection unit configured to adjustably control the path of an ion passing through the diffuser element;
- and
- a control unit configured to drive said deflection unit to obtain a predefined diffuser configuration.
A plating reactor, comprising:
- a substrate holder configured to hold a workpiece in place;
- and
- a diffuser element positioned in front of said substrate holder, wherein the diffuser element comprises an adjustment mechanism to adjust an effective size of passages formed in the diffuser element.
A plating reactor comprising:
- a substrate holder adapted to hold a workpiece in place;
- and
- a diffuser element arranged in front of said substrate holder and including a first pattern of passages and a second pattern of passages, wherein the first and second patterns are movably attached relative to each other to allow a variation of a degree of overlap of the passages of the first and second patterns.
A plating reactor comprising:
- a substrate holder configured to hold a workpiece in place;
- and
- a diffuser element arranged in front of said substrate holder and including a deflection unit configured to remotely control the path of an ion passing through said diffuser element.
A method of plating the surface of a workpiece, the method comprising:
- providing a substrate holder configured to hold the workpiece in place;
- providing an electrolyte at least in front of the workpiece;
- providing a diffuser element in front of the workpiece surface, wherein the diffuser element is configured to allow adjusting an effective size of passages formed in the diffuser element;
- and
- directing electrolyte towards the workpiece surface, wherein a configuration of the diffuser element selected by adjusting the effective size of the passages provides for a required deposition rate on the workpiece.
A method of plating a workpiece, the method comprising:
- providing a substrate holder configured to hold the workpiece in place;
- providing a diffuser element including at least one electromagnetically controllable deflection element;
- and
- directing electrolyte towards the workpiece surface while controlling a configuration of said diffuser element by supplying a corresponding drive signal to said at least one electromagnetically controllable deflection element.
Dependencies are inferred from the claim text.