Apparatus and method for electrochemical metal deposition
AssigneeAdvanced Micro Devices, Inc.
InventorsAxel Preusse, Gerd Marxsen
Life of this patent
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Abstract
In an electroplating apparatus for semiconductor wafers, the currents to each of a plurality of contact portions contacting the wafer edge are individually adjustable and/or a parameter indicative of the current flow in each contact portion may be determined. Moreover, for precise control of the currents, means are provided for monitoring the currents.
Claims43
A method of electroplating a layer of an electrically-conductive material on a workpiece, comprising:
- supplying electrical current to the workpiece through a plurality of contact portions contacting the workpiece at corresponding different locations;
- and
- individually adjusting a current in at least two of said contact portions.
A method of electroplating a layer of an electrically-conductive material on a workpiece, comprising:
- supplying electrical current to the workpiece through a plurality of contacting lines contacting the workpiece at corresponding different locations;
- and
- determining the current in each of said contacting lines.
An electroplating apparatus for electroplating a layer of an electrically-conductive material on a workpiece, comprising:
- a plurality of contact portions for supplying current to the workpiece, said contact lines being adapted to be brought into contact with the workpiece at corresponding different locations;
- and
- a measuring device configured to measure a parameter indicative of a current in at least some of the contact portions.
An electroplating apparatus for electroplating a layer of an electrically-conductive material on a workpiece, comprising:
- a plurality of contact portions for supplying current to the workpiece, said contact portions being adapted to be brought into contact with the workpiece at corresponding different locations;
- and
- a supply unit configured to adjustably and individually supply at least one of a current and a voltage to at least some of the contact portions.
Dependencies are inferred from the claim text.