Multilayered wiring board, method of producing multilayered wiring board, electronic device and electronic apparatus
AssigneeSeiko Epson Corporation
InventorsMasahiro Furusawa, Hirofumi Kurosawa, Takashi Hashimoto, Masaya Ishida
Life of this patent
Estimating the term…
Abstract
A method of producing a multilayered wiring board having at least two wiring layers (wiring patterns 17, 31), polyamide 22 (an interlayer insulation film) between the wiring layers, and an interlayer conducting post (a conductor post) 18 for conducting between the wiring pattern 17 and the wiring pattern 31, wherein the polyimide 22 is disposed around the interlayer conducting post 18 using a liquid drop discharge system.
Claims20
A method of producing a multilayered wiring board comprising:
- providing at least two wiring layers, an interlayer insulation film between the wiring layers, and a conductor post for conducting between the wiring layers, and
- disposing the interlayer insulation film around the conductor post using a liquid drop discharge system.
A multilayered wiring board, comprising:
- at least two wiring layers, an interlayer insulation film disposed between the wiring layers, and a conductor post for conducting between the wiring layers, and
- wherein the conductor post is an inverted cone with a thickness of about 1 micrometer to 20 micrometers and a diameter of about 10 micrometers to 200 micrometers.
A method of making an electronic device comprising:
- (a.) depositing droplets of fluid onto selected portions of a board, the fluid having conductive particles and a carrier liquid;
- (b.) heating the droplets to remove the carrier liquid;
- (c.) repeating steps (a.) and (b.) to build a first wiring layer of a given thickness;
- (d.) forming a plurality of conductive posts having a given height on selected portions of the first wiring layer;
- (e.) depositing droplets of an insulator material onto the board to surround the posts while leaving tops of the posts exposed;
- (f.) curing the insulator material;
- (g.) using steps (a.) thru (c.) to form a second wiring layer, with the posts connecting portions of the wiring layers together;
- and
- (h.) electrically connecting the device to one the wiring layers.
Dependencies are inferred from the claim text.