Socketless package to circuit board assemblies and methods of using same
OwnerMirng-Ji Lii, Yuan-Liang Li +1inventors
InventorsMirng-Ji Lii, Yuan-Liang Li, Chia-Pin Chiu
Life of this patent
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Abstract
A readily demountable socketless package to circuit board assembly is disclosed. The assembly includes a soft solder area and a metallic contact element, each located on copper pads. The metallic contact element is adapted to sufficiently penetrate the soft solder area to provide electrical contact. The metallic contact element can be either a sharp metallic element or a spring. Compressive force from a clamping mechanism ensures a secure electrical contact and adequate thermal performance.
Claims39
An apparatus comprising:
- a socketless package having a package pad, the package pad having a metallic contact element secured thereto and adapted to penetrate a solder area sufficiently to create an electrical contact, the solder area located on a circuit board pad.
An apparatus comprising:
- a socketless package having a package pad, the package pad having a solder area located thereon, the socket area penetrable by a metallic contact element sufficiently to create an electrical contact between the solder area and the metallic contact element, wherein the metallic contact element is located on a circuit board pad.
An apparatus comprising a socketless package to circuit board assembly, the assembly including a solder area and an opposing metallic element, wherein the metallic element can penetrate the solder area sufficiently to create an electrical contact.
An assembly comprising:
- a solder area deposited on a first pad, the solder area containing solder having a melting temperature of between about 100 and 220° C.;
- and
- a metallic contact element connected to a second pad, the metallic contact element adapted to penetrate the solder area sufficiently to create an electrical interconnection.
A package comprising:
- a metallic contact element strip containing a plurality of metallic contact elements adapted to penetrate a plurality of solder areas sufficiently to create electrical contacts, each solder area having solder with a melting temperature of between about 100 and 220° C.
A method comprising:
- substantially aligning a first pad and a second pad, the first pad coated with soft solder and the second pad having a metallic contact element built thereon;
- joining the soft solder and metallic contact element together wherein the metallic contact element penetrates the soft solder sufficiently to create an electrical contact;
- clamping the first pad and second pad together with a compressive force apparatus wherein a package is temporarily assembled directly on a circuit board.
Dependencies are inferred from the claim text.