Magnetic shielding for electronic circuits which include magnetic materials
AssigneeFreescale Semiconductor, Inc.
InventorsNicholas D. Rizzo, Mark A. Durlam, Michael J. Roll, Kelly Kyler, Jaynal A. Molla
Life of this patent
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Abstract
A shielded electronic integrated circuit apparatus (5) comprising a substrate (10) with an electronic integrated circuit (15) formed thereon, a dielectric region (12) positioned on the substrate and the electronic integrated circuit wherein the dielectric region and the substrate are substantially surrounded by a magnetic material region (26, 30) deposited using electrochemical deposition and wherein the electronic integrated circuit is shielded from electromagnetic radiation.
Claims74
A shielded electronic circuit apparatus comprising:
- an electronic circuit positioned on a surface of a substrate wherein the substrate has a thickness and includes an opposed surface and at least one side;
- a dielectric region positioned on the electronic circuit wherein the dielectric region includes a surface and at least one side;
- a first magnetic material region positioned on one of the opposed surface of the substrate and proximate to the surface of the dielectric region;
- and
- wherein the first magnetic material region is formed using a first electrochemical deposition bath.
A shielded electronic integrated circuit apparatus comprising:
- a substrate having a thickness, a surface, an opposed surface, and at least one side wherein an electronic integrated circuit is formed on said surface;
- a dielectric region positioned on the electronic integrated circuit wherein the dielectric region includes a surface and at least one side;
- a first magnetic material region positioned on one of the surface of the dielectric region and the opposed surface of the substrate;
- wherein the first magnetic material region includes a first glue layer positioned adjacent to the one of the surface of the dielectric region and the opposed surface of the substrate, a first seed layer positioned on the first glue layer, and a first magnetic material layer positioned on the first seed layer;
- and
- wherein the first magnetic material layer is formed by immersing the first seed layer in a first electrochemical deposition bath.
A method of shielding an electronic circuit comprising the steps of:
- providing a substrate with a thickness and an electronic integrated circuit formed thereon said substrate, the substrate including a surface, an opposed surface, and at least one side;
- providing a dielectric region positioned on the electronic integrated circuit wherein the dielectric region includes a surface and at least one side;
- and
- forming a first magnetic material region positioned on one of the surface of the dielectric region and the opposed surface of the substrate wherein the first magnetic material region includes a first glue layer positioned adjacent to the one of the surface of the dielectric region and the opposed surface of the substrate, a first seed layer positioned on the first glue layer, and a first magnetic material layer positioned on the first seed layer, and wherein the first magnetic material layer is formed by immersing the first seed layer in a first electrochemical deposition bath.
A shielded electronic integrated circuit apparatus comprising:
- a substrate with a thickness, the substrate including a surface, an opposed surface, and at least one side wherein an electronic integrated circuit is formed thereon said surface;
- a dielectric region positioned on the surface of the substrate and the electronic integrated circuit wherein the dielectric region includes a surface and at least one side;
- a first magnetic material region positioned on the surface of the dielectric region;
- wherein the first magnetic material region includes a plurality of superparamagnetic particles with a particle size, the plurality of superparamagnetic particles being suspended in a non-magnetic matrix;
- wherein the particle size of the plurality of superparamagnetic particles is chosen to attenuate a desired range of frequencies of electromagnetic radiation.
A shielded electronic integrated circuit apparatus comprising:
- a metal support wherein the metal support includes a first magnetic material which behaves as a shield;
- a substrate with a thickness positioned on the metal support, the substrate including a surface, an opposed surface positioned adjacent to the metal support, and at least one side wherein an electronic integrated circuit is formed thereon said surface;
- and
- a dielectric region positioned on the surface of the substrate and the electronic integrated circuit wherein the dielectric region includes a surface and at least one side.
Dependencies are inferred from the claim text.