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AssigneeSeiko Epson Corporation
InventorsMasashi Kasuga, Tomoyuki Kamakura, Wakao Miyazawa, Fukumi Tsuchihashi
Estimating the term…
To provide a manufacturing apparatus in which inter-substrate transfer of a thin film circuit or a thin film element can automatically be performed. An apparatus for manufacturing electronic devices includes a laser device (101) for generating laser beams (101a), a masking unit (102) having a masking substrate for shaping beam spots of the laser beams, a first stage (300) for placing a first substrate (301), which carries a object to be transferred, a second stage (200) for placing a second substrate (201), to which the object to be transferred is transferred, an adhesive agent applying unit (500) for applying an adhesive agent on the object to be transferred or on a transferred position on the second substrate, and a control unit (700) for controlling the actions of the first and the second stages, and is characterized in that the control unit (700) transfers the object to be transferred from the first substrate to the second substrate by the steps of moving at least one of the first and the second stages for performing inter-substrate alignment of the masking substrate, the first and the second substrates, adhering the first and the second substrates, irradiating a laser beam onto the object to be transferred, and moving the first and the second substrates away from each other.
An apparatus for manufacturing electronic devices comprising:
A method for manufacturing electronic devices using a transfer technology in which an object to be transferred formed on a first substrate is transferred onto a second substrate, comprising the steps of:
A method for manufacturing electronic devices using a transfer technology in which an object to be transferred formed on a first substrate is peeled and transferred to a second substrate, comprising the steps of:
A method for manufacturing electronic devices using a transfer technology in which an object to be transferred formed on a first substrate is transferred to a second substrate, comprising the steps of:
A method of manufacturing electronic devices using a transfer technology in which an object to be transferred formed on a first substrate is peeled and transferred to a second substrate, comprising the steps of:
Dependencies are inferred from the claim text.