Flow sensor and method for producing the same
AssigneeSensirion AG
InventorsChristoph Kleinlogel, Ralph Steiner-Vanha, Felix Mayer
Life of this patent
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Abstract
The invention relates to a flow sensor comprising a substrate with integrated heat source and temperature sensors. Solder bumps are arranged on the heat source and the temperature sensors and the substrate is attached to the outside of a tube using flip chip technology. Preferably, the outside of the tube is structured for being wetted at appropriate positions by the solder. This allows to assemble the sensor easily and accurately.
Claims19
A method for producing a flow sensor comprising the steps of
- providing a tube for containing a fluid to be measured,
- providing a substrate with a flow detector integrated thereon, said flow detector having at least one heat source and at least one temperature sensor,
- applying solder bumps to said heat source and said temperature sensor and/or to said tube,
- placing said substrate against said tube and applying heat for melting said solder bumps, such that, after cooling, said solder bumps form a first thermal connection between said heat source and said tube and a second thermal connection between said temperature sensor and said tube, wherein the thermal connections are located at a distance from each other.
A method for producing a flow sensor, said sensor comprising a tube for containing a fluid to be measured and a substrate with at least one flow detector arranged thereon, said flow detector having at least one heat source and at least one temperature sensor, said method comprising the steps of
- applying solder bumps to said heat source and said temperature sensor and/or to said tube,
- attaching said substrate to said tube using flip chip technology by melting said solder bumps, such that, after cooling, said solder bumps form a first thermal connection between said heat source and said tube and a second thermal connection between said temperature sensor and said tube, wherein the thermal connections are located at a distance from each other.
A flow sensor comprising
- a tube for containing a fluid to be measured,
- a semiconductor substrate with a flow detector integrated thereon, said flow detector having at least one heat source and at least one temperature sensor,
- solder bumps arranged between said heat source and said tube and between said temperature sensor and said tube, said solder bumps being soldered to said tube and said heat source or that temperature sensor, respectively, and forming a first thermal connection between said heat source and said tube and a second thermal connection between said temperature sensor and said tube, wherein the thermal connections are located at a distance from each other.
A semiconductor substrate for a flow sensor, said semiconductor substrate comprising
- a flow detector integrated on the substrate, said flow detector having at least one heat source and at least one temperature sensor,
- at least one first solder bump arranged on said heat source and
- at least one second solder bump arranged on said temperature sensor for attaching said substrate to a tube using flip-chip technique.
Dependencies are inferred from the claim text.