Method of making a flexible substrate containing self-assembling microstructures
AssigneeAvery Dennison Corporation
InventorsPi Chang, Philip Yi Zhi Chu, Dong Hseih, Robert M. Pricone, W. Scott Thielman
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AssigneeAvery Dennison Corporation
InventorsPi Chang, Philip Yi Zhi Chu, Dong Hseih, Robert M. Pricone, W. Scott Thielman
Estimating the term…
A substrate having embossed thereon a plurality of shaped recesses of a predetermined precise geometric profile, each recess having a flat bottom surface having a major dimension of about 500 μm or less, the substrate being capable of undergoing a thermal cycle of about one hour at about 150° C. while maintaining about ±10 μm or less dimensional stability of the embossed shaped indentations, and wherein the substrate comprises an amorphous thermoplastic material. During the thermal cycle the substrate has an elastic modulus greater than about 1010 dynes/cm2 and a viscoelastic index of less than about 0.1.
A substrate having embossed thereon a plurality of shaped recesses of predetermined dimensions, each recess having a flat bottom surface, the length and width of such flat bottom surface each being about 1000 μm or less, said substrate comprising an amorphous thermoplastic material such that said substrate is capable of undergoing a thermal cycle of about one hour at about 150° C. while maintaining about ±10 μm or less dimensional stability of said embossed shaped indentations.
An article comprising
A method for forming an amorphous thermoplastic product having precise embossed surfaces requiring sharp angles and flatnesses, comprising the steps of:
A method of assembling a microstructure on a substrate, said substrate comprising a top surface with at least one recessed region thereon, said method comprising the steps of:
An article comprising
Dependencies are inferred from the claim text.