Manufacturing method for conductive layer wiring, layered structure member, electro-optic device, and electronic apparat

Abstract

A first liquid including a first metal particle is disposed on the base board (11) via a liquid ejecting section (10) so as to form a conductive layer wiring having a predetermined pattern on a base board (11). A surface of the base board (11) is treated so as to be liquid-repellent. A second liquid which is different from a first liquid is disposed on the base board (11) by a liquid ejecting section (10) in advance. Thus, an interlayer W1 which can improve an adhesion between the base board (11) and the conductive layer wiring is formed. By doing this, a method for forming a conductive layer wiring for realizing a finer width in the conductive layer wiring and enhancing an adhesion between the base board and the conductive layer wiring can be provided.

Dependencies are inferred from the claim text.