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US 2003/0229162 A1Published application
Polyamide resin composition
AssigneesKuraray Co., Ltd., Asahi Denka Co., Ltd.
InventorsHideharu Matsuoka, Hideaki Oka, Koichi Uchida, Masahide Tsuzuki, Koji Beppu
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Abstract
A polyamide resin composition contains 100 parts by weight of (A) a polyamide resin with a melting point of 270° C. to 340° C.; 0.2 to 20 parts by weight of (B) a compound represented by Formula (I) 1 where R1 and R2 are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3; and 1 to 100 parts by weight of (C) a bromine-based flame retardant.
Claims9
A polyamide resin composition comprising
- 100 parts by weigh of (A) a polyamide resin with a melting point of 270° C. to 340° C.;
- 0.2 to 20 parts by weight of (B) a compound represented by Formula (I)
- 5
- where R1 and R2 are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3;
- and
- 1 to 100 parts by weight of (C) a bromine-based flame retardant.
3 more elements
Dependencies are inferred from the claim text.