Manufacturing method of semiconductor device
AssigneeNEC Electronics Corporation
InventorsMichihisa Kohno, Yuji Shimizu
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Abstract
A manufacturing method of the present invention comprises the steps of patterning to form a gate electrode pattern as well as an oxide film pattern by applying dry etching to a layered film which is formed, on a semiconductor substrate, of an oxide film and a SiGe film, being laid in this order; a first cleaning wherein, after the step of the patterning, the semiconductor substrate is cleaned with a first cleaning solution containing hydrofluoric acid; and a second cleaning wherein, after the step of the first cleaning, the semiconductor substrate is cleaned with a second cleaning solution containing ammonia and hydrogen peroxide.
Claims6
A method of manufacturing a semiconductor device having, on a semiconductor substrate, a gate which comprises a gate oxide film and a SiGe film containing Si and Ge;
- which comprising the steps of:
- a patterning to form a gate electrode pattern as well as an oxide film pattern by applying dry etching to a layered film which is formed, on the semiconductor substrate, of an oxide film and the SiGe film, being laid in this order;
- a first cleaning wherein, after the step of the patterning, the semiconductor substrate is cleaned with a first cleaning solution containing hydrofluoric acid;
- and
- a second cleaning wherein, after the step of the first cleaning, the semiconductor substrate is cleaned with a second cleaning solution containing ammonia and hydrogen peroxide.
Dependencies are inferred from the claim text.